Chongqing Huanxiang Industrial Co.,Ltd

Showing 81 - 90 of 99, total 10 pages [First] [Previous] [Next] [Last]

printed circuit board (pcb)
Specification: VOP PCB
Detail: Layers: 6L Material: Normal TG150 Thickness of finished plate: 1.0mm Minimum aperture: 0.15mm Minute cable width/***cing: 0.075mm/ 0.075mm Surface Treatment: Immersion Gold 2" Product ...

printed circuit board (pcb)
Specification: VOP PCB
Detail: Layer: 4 L Material: Medium TG150 Thickness of finished plate: 1.6mm Minute aperture: 0.2mm Minimum cable width/***cing: 0.08mm/0.07 mm Surface Treatment: Immersion Gold 2" Impedance c...

printed circuit board (pcb)
Specification: VOP PCB
Detail: Layer:6L Material:Height-TG180 Finished Board Thickness:1.2 mm Minute aperture: 0.15mm Minute cable width/***cing: 0.075mm/ 0.075mm Surface Treatment: Immersion Gold 2" Vias In Pads with resin plu...

printed circuit board (pcb)
Specification: Double Sides PCB
Detail: Layer :2L Material: FR4 (CTI>600) Finished Board Thickness:1.6mm Minimum Hole Dia. : 0.35mm Minimum Line ***cing :0.125mm/0.125mm Finish: Lead-free tin spray Application: Acoustic equipment

printed circuit board (pcb)
Specification: High Density Interconnect PCB
Detail: Layer :4L HDI Material: FR4 (Tg150) Finished Board Thickness:1.2mm Minimum Hole Dia.: 0.2mm Minimum Line ***cing :0.08mm/0.07mm Surface Treatment :Immersion 2U" Product features: Impedance control Appl...

printed circuit board (pcb)
Specification: High Density Interconnect
Detail: Layer :6L 2+N+2HDI Material: FR4 (Tg180) Finished Board Thickness:1.6mm Minimum Hole Dia.: 0.1mm (Laser drill) Minimum Line ***cing :0.075mm/0.075mm Surface Treatment :Immersion 2U" Features: Laser drilling, ...

printed circuit board (pcb)
Specification: High Density Interconnect
Detail: Layer:4L HDI Material: FR4 (Tg180) Finished Board Thickness :1.0mm Minimum Hole Dia. : 0.1mm (Laser drill) Minimum ***cing:0.075mm/0.075mm Surface Treatment :Immersion Gold 2U" Features: Laser drilling, imped...

printed circuit board (pcb)
Specification: High Density 4Layers PCB
Detail: Layer :6Layers Material: HighTG170 Finished Board Thickness :1.6mm Minumum Hole Dia.: 0.2mm Minimum Line ***cing:0.08mm/0.065 Surface Treatment :Immersion Gold 2" Features: Impedance control,BGAsize0.25mm ...

printed circuit board (pcb)
Specification: Blind Vias Holes+High Density PCB
Detail: Layer :6L BVH+HDI Material: FR4 (Tg170) Finished Board Thickness :1.0mm Minumum Hole Dia.: 0.1mm (Laser drill) Minimum Line ***cing:0.075mm/0.075mm Surface Treatment :Immersion Gold 2U" Features: Laser drilli...

printed circuit board (pcb)
Specification: 6 layers Impedance Gold Immersion PCB
Detail: 6 layers Impedance Gold Immersion PCB


Showing 81 - 90 of 99, total 10 pages [First] [Previous] [Next] [Last]
1 2 3 4 5 6 7 8 9 10